More powerful, more thin, the evolution of data storage opens up great possibilities for the future of computing.
A team of electrical engineers at The University of Texas at Austin, in collaboration with Peking University scientists, has developed the thinnest memory storage device with dense memory capacity, paving the way for faster, smaller and smarter computer chips for everything from consumer electronics to big data to brain-inspired computing.
“For a long time, the consensus was that it wasn’t possible to make memory devices from materials that were only one atomic layer thick,” said Deji Akinwande, associate professor in the Cockrell School of Engineering’s Department of Electrical and Computer Engineering. “With our new ‘atomristors,’ we have shown it is indeed possible.”
Made from 2-D nanomaterials, the “atomristors” — a term Akinwande coined — improve upon memristors, an emerging memory storage technology with lower memory scalability. He and his team published their findings in the January issue of Nano Letters.
“Atomristors will allow for the advancement of Moore’s Law at the system level by enabling the 3-D integration of nanoscale memory with nanoscale transistors on the same chip for advanced computing systems,” Akinwande said.